TY  - BOOK
AU  - Wang,Guo'an
AU  - Pan,Bo
TI  - Passive RF component technology: materials, techniques, and applications 
T2  - Artech House microwave library
SN  - 9781608071999
AV  - TK6560 .P37 2012
U1  - 621.3815 23
PY  - 2012///]
CY  - Boston, London
PB  - Artech House
KW  - Passive components
KW  - Radio circuits
KW  - Wireless communication systems
N1  - Includes bibliographical references and index; Chapter 1. Introduction -- chapter 2. Overview of RF passives and enabling materials -- chapter 3. Novel flexible material liquid crystal polymer (LCP) based flexible passives -- chapter 4. Ferroelectric-based tunable RF capacitor -- chapter 5. High aspect ratio RF passives enabled by smart RF materials and polymer-core conductor micromachining technologies -- chapter 6. CNT-based passive circuits and detectable components -- chapter 7. Paper-based green RFID and other passives -- chapter 8. Flexible magnetic composites -- chapter 9. Composite right-/left-handed metamaterials and their RF applications -- chapter 10. Designing novel on-chip millimeter wave passives
N2  - Focusing on novel materials and techniques, this pioneering volume provides engineers with a solid understanding of the design and fabrication of smart RF passive components. Professionals find comprehensive details on LCP, metal materials, ferrite materials, nanomaterials, high aspect ratio enabled materials, green materials for RFID, and on-chip silicon techniques. --; Moreover, this practical book offers expert guidance on how to apply these materials and techniques to design a wide range of cutting-edge RF passive components, from MEMS switch-based tunable passives and 3D passives, to metamaterial-based passives and on-chip passives. Supported with over 145 illustrations, this forward-looking resource summarizes the growing trend of smart RF passive component design and serves as a guide to the performance-improving and cost-down solutions this technology offers the next generation of wireless communications. --Book Jacket
ER  -